Engineer BGA Package Design(Hea Job/ 47)

Main tasks:

1. Carry out multi-layer BGA substrate designs (wire-bond, Flip-chip or System-in-Package) meeting signal/power/thermal requirements and assembly design rules on package level within Infineon’s product development projects
2. Recommend packaging solutions and conduct feasibility studies to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or application
3. Co-work with simulation engineers to verify the electrical/thermal package performance

Candidate profile:

1. A degree in electrical engineering, mechatronics, physics or a comparable education
2. Min. 3-5 years of experience in semiconductor package design
3. Know how in design of different package technologies (lead frame, BGA, FCIP…) preferably with focus on microcontroller applications
4. Solid working experience with the package design tool Cadence SIP
5. Experience in assembly engineering or production would be beneficial
6. Self-organized and independent working style
7. Very good English language skills